GET CONNECTED 02 with Future Connectivity Solutions

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Get Smart • Get Efficient • Get to Market Quickly
GET CONNECTED
with Future Connectivity Solutions
ISSUE
02
FEATURED TECHNOLOGIES
802.15.4 / Sub-Gig
Bluetooth
Cellular
Wi-Fi
NEW PRODUCT INTRODUCTIONS
PSoC4® 4 BLE: PSoC Now Integrates
Bluetooth® Low Energy
by Cypress
Taking the world wireless
HumRC™ Series Remote Control
and Sensor Transceiver
by Linx
PAN1740 Place and Play
Bluetooth® Low Energy Module
by Panasonic
Sierra Wireless AirPrime®
Embedded Modules HL Series
by Sierra Wireless
1
TABLE OF CONTENTS
ISSUE 2
802.15.4 / SUB-GIG
Linx - HumRC™ Series Remote Control and
Sensor Transceiver Offers Amazing Flexibility in a Tiny, Low Cost Package!
3
BLUETOOTH
Cypress - PSoC4® 4 BLE: PSoC Now Integrates Bluetooth® Low Energy
5
Microchip - BM77 Bluetooth® 4.0 Dual Mode Module
7
Panasonic - Panasonic: Place and Play Bluetooth® Low Energy Module
9
CELLULAR
Multi-Tech - MultiTech’s MultiConnect® rCell - More than Just a Router!
10
Sierra - Sierra Wireless AirPrime® Embedded Modules HL Series
12
WI-FI
Gainspan - HD / Full HD Video Application Development Kits
14
Murata - Wi-Fi® 802.11 b/g/n Network Controller Module
15
Silex - Silex: 802.11b/g/n and 802.11a/b/g/n Embedded Intelligent
Wireless Modules
17
GET CONNECTED | ISSUE 2
2
HUMRC™ SERIES REMOTE CONTROL AND
SENSOR TRANSCEIVER OFFERS AMAZING
FLEXIBILITY IN A TINY, LOW COST PACKAGE!
The HumRC™ transceiver is designed for reliable bi-directional remote
control and sensor applications. The module includes a Frequency Hopping Spread spectrum (FHSS) protocol and supports versions at 2.4GHz
and 900MHz with a common footprint and pin out in this initial release,
with 868MHz and others to follow in the near future. This common footprint
across the available frequencies also makes it suitable for global sale, so
one product can be manufactured and sold around the world.
Figure 1: Hum-900-RC
Figure 2: Hum-2.4-RC
Figure 5: HumRC Basic
Module Footprint
Figure 6: Combined HumRC Module
Footprint (basic and future pre-certified design)
APPLICATIONS
Figure 3: EVM-900-RC
• Remote control with global
certifications
• Electronic signage
• Irrigation control
• Home and industrial automation
• Remote access control with
confirmation
• Remote status monitoring
• Robotics
BENEFITS
• Simple long range remote control
implementation
• Optimized for battery powered
devices
• Bi-directional operation and
selectable acknowledgements
provide a great deal of functionality
• Advanced features are available
through a standard UART serial
interface
FEATURES
• Low Cost (under $9 in volume)
• No external RF components required
• No programming/tuning required
• Serial interface for optional software
operation/configuration
• Tiny PLCC-32 footprint
Figure 4: EVM-2.4-RC
TECHNOLOGY | 802.15.4 / SUB-GIG
3
PART SELECTOR TABLE
PART NUMBER
DESCRIPTION
DEVELOPMENT KITS
MDEV-900-RC
HUM-RC Master Development System 900 MHz, USB Module
MDEV-2.4-RC
HUM-RC Master Development System 2.4 GHz, USB Module
EVAL-900-RC
HUM-RC Series Basic Evaluation Kit, 900 MHz
EVAL-2.4-RC
HUM-RC Series Basic Evaluation Kit, 2.4 GHz
TRANSCEIVERS
HUM-900-RC
HUM-RC Series Remote Control and Sensor FHSS 10 dBm RF Transceiver 900 MHz
HUM-2.4-RC
HUM-RC Series Remote Control and Sensor FHSS RF Transceiver 2.4 GHz
HUMMINGBIRD TRANCEIVERS ON BOARDS
EVM-900-RC
HUM RC EVM Module, 900 MHz, Pin mount with integrated RF connector
EVM-2.4-RC
HUM RC EVM Module, 2.4 GHz, Pin mount with integrated RF connector
MDEV-900-RC
MDEV-2.4-RC
Master Development Kit
EVAL-900-RC
EVAL-2.4-RC
Basic Evaluation Kit
TECHNOLOGY | 802.15.4 / SUB-GIG
4
PSOC4® 4 BLE: PSOC NOW INTEGRATES
BLUETOOTH® LOW ENERGY
FEATURES/SPECS
•
•
•
•
Figure 1: Bluetooth SMART
PSoC 4 BLE is an easy-to-use,
ARM® Cortex™-M0 based, singlechip solution which integrates
programmable analog front ends,
programmable digital peripherals,
CapSense® technology for touchsensing, and a Bluetooth® LE (Low
Energy) or Bluetooth Smart radio.
Bluetooth Core Specification 4.1
48-MHz ARM® Cortex™-M0 CPU
Up to 128 KB Flash and 16 KB SRAM
Bluetooth Smart Connectivity with
Bluetooth v4.1 Protocol Stack
o 2.4 GHz Bluetooth Low Energy
Radio with integrated Balun
o -92 dBm Rx Sensitivity, +3 dBm
Tx Output Power
• Programmable analog
o 4 x Opamps
o 1 x 12-bit, 1-Msps SAR ADC
o 2 x Low-Power Comparators
o 1 x Cypress CapSense™ touch
controller with SmartSense™
Auto-Tuning
• Programmable digital
o 4 x universal digital blocks
o 4 x 16-bit configurable Timer/
Counter/PWM blocks
o 2 x configurable serial
communication blocks
• Up to 36 GPIOs available in 56QFN (7x7x0.6 mm) and 68-CSP
(3.9x2.5x0.55 mm) packages
• Flexible Low Power Modes
o 1.3-μA Deep-Sleep Current
o 150-nA Hibernate Current
o 60-nA Stop Current
• Wide Operating Range 1.7 - 5.5 V
(Radio operational 1.9 V onwards)
http://wwww.cypress.com/psoc4ble
APPLICATIONS
•
•
•
•
•
Internet of Things (IoT)
Wearable Electronics
Medical Devices
Fitness Accessories
Home Entertainment
BENEFITS
• Enables complete system design in
PSoC Creator
• Simplifies the BLE Protocol Stack and
Profile configuration with the easy-touse BLE Component
• Simplifies RF board design by
integrating the Balun
• Integrates programmable AFEs and
digital logic, and CapSense with the
ARM Cortex-M0 CPU and BLE radio
• Delivers five flexible, easy-to-use,
low-power modes
Figure 2: PSoC 4 BLE One-Chip Solution
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
| 802.15.4
|| BLUETOOTH
ANTENNAS
/ SUB-GIG
5
Demo, Evaluation or
Developments tools
The CY8CKIT-042-BLE development
kit supports system-level designs
using PSoC Creator which includes
numerous example projects to
enable Bluetooth Low Energy
mixed signal embedded designs.
The Bluetooth Low Energy v4.1
specification has been abstracted
into the new Bluetooth Smart
Figure 3: CY8CKIT-042-BLE
Component in PSoC Creator,
allowing for easy drag-anddrop designs. The development
kit has been designed to allow
for maximum design flexibility
enabling Arduino shields hardware
compatibility and easy to use, FCCcertified PSoC 4 BLE and PRoC BLE
modules.
Part Number: CY8CKIT-042-BLE
PART SELECTOR TABLE
PART NUMBER1
CPU SPEED
UDB
SCB2
TCPWM3
SAR4 ADC
IDAC5
CY8C4127LQI-BL473
24 MHz
0
2
4
806 ksps
2
CY8C4127LQI-BL453
24 MHz
0
2
4
806 ksps
2
CAPSENSE
OPAMPS
COMPARATORS
PACKAGE
2
2
56-QFN
2
2
56-QFN
X
PSoC 4 BLE Product Selector Guide
CY8C4127LQI-BL483
24 MHz
0
2
4
806 ksps
2
X
2
2
56-QFN
CY8C4127FNI-BL483
24 MHz
0
2
4
806 ksps
2
X
2
2
68-CSP
Part Number1
CPU Speed
UDB
SCB2 TCPWM3 SAR4 ADC
IDAC5 CapSense Opamps
Comparators Package
MHz4
02
2
ksps2
2
24
2
24 MHz
0
2
806 ksps
2
2
CY8C4247LQI-BL473
48 MHz24
CY8C4127LQI-BL473
CY8C4127LQI-BL453
CY8C4247LQI-BL453
48 MHz
4
2
CY8C4127LQI-BL483
24 MHz
0
2
CY8C4127FNI-BL483
24 MHz
0
2
CY8C4247LQI-BL463
48 MHz
4
2
CY8C4247LQI-BL473
48 MHz
4
2
CY8C4247LQI-BL453
48 MHz
4
2
CY8C4247LQI-BL463
48 MHz
4
2
CY8C4247FNI-BL483
48 MHz
4
2
AllCY8C4247FNI-BL483
part numbers support: Industrial temperature (-40ºC
48 MHz
4
to +85ºC), 36 GPIO, 128KB flash and input voltage range
from 1.9 V to 5.5 V
1
PSoC 4 BLE Part Numbering Decoder
4
4
4
4
4
4
4
4
4
4
4
1 Msps806
2
ü
2
806 ksps
2
X
ü
4
2
2
806 ksps
2
ü
2
2
1 Msps
1 Msps
1 Msps
1 Msps
1 Msps
1 Msps
2
2
2
2
2
2
Serial communication block
3
Timer, counter, pulse-width modulator block
2
4
1 Msps
4
2
ü
X
ü
4
2
4
2
4
2
4
2
56-QFN
56-QFN
56-QFN
2
56-QFN
56-QFN
68-CSP
2
2
56-QFN
56-QFN
56-QFN
68-CSP
56-QFN
4
Successive approximation register
5
Current-output digital-to-analog converter
4
2
68-CSP
CY 8C 4X X X XX X BLXXX
Device Identification Number that corresponds to the part feature set
Temperature Range: I = Industrial
Package: FN = CSP, LQ = QFN
Flash Size: 7 = 128KB, 8 = 256KB
CPU Speed: 2 = 24 MHz, 4 = 48 MHz
Product Type: 42 = Programmable Digital, 41 = Intelligent Analog
Marketing Code: 8C = PSoC Platform
Company ID: CY = Cypress
1 All
part numbers support: Industrial temperature (-40ºC to +85ºC),
36 GPIO, 128KB flash and input voltage range from 1.9 V to 5.5 V
001-92533
Rev **
2 Serial
communication block
3 Timer, counter, pulse-width modulator block
Figure 4: PSoC 4 BLE Part Numbering Decoder
Owner: GUL
PSoC 4 BLE New Product Introduction
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
| 802.15.4
|| BLUETOOTH
ANTENNAS
/ SUB-GIG
4 Successive
5
approximation register
Current-output digital-to-analog converter
16
6
BM77 BLUETOOTH® 4.0 DUAL MODE MODULE
APPLICATIONS
Figure 1: BM77
The BM77 is a fully-certified
Bluetooth® Version 4.0 (BR/EDR/
LE) module for designers who want
to easily add dual mode Bluetooth
wireless capability to their products.
Delivering local connectivity for the
Internet of Things (IoT), the BM77
bridges your product to Smart
Phones and Tablets for convenient
data transfer, control and access to
cloud applications.
This Bluetooth SIG certified
(QDID:B021961) module provides
a complete wireless solution
with Bluetooth stack on-board,
integrated antenna, and worldwide
radio certifications in a compact
surface mount package, 22 x 12 x 2.4
mm. It supports GAP, SDP, SPP, and
GATT profiles. Data is transferred
over the Bluetooth link by sending/
receiving data via transparent
mode over UART, making it easy
to integrate with any processor
or Microcontroller with a UART
interface. Configuration is made
easy using a Windows® based GUI
or directly via UART by a MCU.
•
•
•
•
•
•
•
•
•
Mobile Point of Sales (mPOS)
LED lighting
Wearables
Digital Sport
Fitness
Health Care/ Medical
On Board Diagnostics (OBD2)
Home Automation
Remote Control Toys
BENEFITS
• Supports both Bluetooth Classic and
Bluetooth Low Energy for advanced
flexibility and capability
• Fully-certified module saves time and
certification costs, speeding time to
market
• Easy to use UART interface for data
transfer
• Easy to configure using Windows app
or direct with any microcontroller
• Compact size (22 x 12 x 2.4 mm) for
size-constrained applications
FEATURES/SPECS
• Fully certified Bluetooth Version 4.0
Module
• Bluetooth Classic and Bluetooth LowEnergy Support
• Bluetooth SIG Certified
(QDID:B021961)
• Onboard embedded Bluetooth Stack
• Easy to use transparent mode for
data transfer via UART
• Multiple I/O pins for control and
status
•
•
•
•
Secure AES128 encryption
GAP, SDP, SPP, GATT profiles
2dBm Transmit Power
Firmware can be field upgradable via
UART
• Compact surface mount module: 22 x
12 x 2.4 mm
• Castellated surface mount pads for
easy and reliable host PCB mounting
• Worldwide regulatory certifications
Figure 2: BM77 Block Diagram
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
| 802.15.4
|| BLUETOOTH
ANTENNAS
/ SUB-GIG
7
PART SELECTOR TABLE
PART NUMBER
DEVELOPMENT TOOL
DESCRIPTION
BM77SPPS3MC2-0007AA
EV77SPPS3MC2A
Bluetooth® 4.0 Dual Mode, Class 2, surface mount module with chip
antenna
BM77SPP03MC2-0007AA
EV77SPPS3MC2A
Bluetooth® 4.0 Dual Mode, Class 2, surface mount module with
external antenna
Figure 3: EV77SPPS3MC2A
The BM77 Bluetooth® Dual Mode Evaluation Board (EVB) allows the
designer to evaluate and demonstrate the capabilities of the BM77
Bluetooth 4.0 Dual Mode Module. The evaluation board includes an
integrated Configuration and Programming USB interface for plug-andplay capability. It also includes on-board breakout pin header connections
for convenient access to the BM77 electrical connections to enable rapid
prototyping.
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
| 802.15.4
|| BLUETOOTH
ANTENNAS
/ SUB-GIG
8
PANASONIC: PLACE AND PLAY BLUETOOTH®
LOW ENERGY MODULE
Figure 1: PAN1740 Series
FEATURES
•
•
•
•
•
•
Bluetooth® Smart Module
Tx Current @0dBm: 5mA
Small Footprint: 9 x 9.5 x 1.8mm
High Sensitivity: -93dbm typ.
Output Power Up to 0dbm
Embedded BLE Stack and GATT
Profile
• Industrial Temperature Range: -40 to
85°C
• Two Internal Crystal Oscillators
• Integrated Antenna
A revolution is underway in
Bluetooth Low Energy to
dramatically shrink power
budgets for battery powered
applications. Panasonic’s
“nanopower” family of 2nd
generation BLE modules reduces
transmit and receive current
consumption by more than 66%
when compared to the current
generation of BLE devices and
nearly a 90% reduction from
Bluetooth Classic devices. Most
significant is that these current
reductions have been achieved
without range reduction, without
Tx power reduction and without
changes to the Bluetooth
specification.
The PAN1740 Series is Panasonic’s
next generation “nanopower”
Bluetooth Low Energy module with
reduced form factor, significantly lower
power consumption, embedded BLE
stack and profile. Panasonic cost
engineering lowers component count
and the application BOM. The single
mode Bluetooth system-on-chip
module is optimized for lower power
and small size. The power consumption
of only 5mA in Tx or Rx mode allows
for the use of coin cell batteries and
reduces battery requirements up to 50%
when compared to current generation
BLE devices. With a fully shielded case,
integrated crystal oscillators and chip
antenna, the 9.0 x 9.5 x 1.8 mm footprint
of the PAN1740 series make it one of
the smallest BLE modules available.
The PAN1740 Series is qualified to the
Bluetooth 4.0 standard – FCC, IC, CE
certifications are pending. Panasonic’s
designer friendly Easy-to-Use (ETU)
development kits reduce design efforts
and critical time to market.
BENEFITS
• Increase battery life
• Reduces module cost and the size of
the end product
• Increase range for reliable
communication
• Module works in harsh environments
• Lowers the application BOM
• Increased design flexibility
APPLICATIONS
•
•
•
•
•
•
Consumer Electronics
Wireless Sensors
Cable Replacement
Instrumentation
Heart Rate Monitor
Blood Glucose Monitor
Figure 2: Block Diagram (PAN1740)
PART SELECTOR TABLE
PART NUMBER
DESCRIPTION
ENW-89846A1KF
EVAL-PAN1740
PAN1740 Bluetooth Low Energy Module, Integrated Antenna
PAN1740 Evaluation Kit, Two USB Development Modules
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
| 802.15.4
|| BLUETOOTH
ANTENNAS
/ SUB-GIG
9
MULTITECH’S MULTICONNECT® RCELL - MORE
THAN JUST A ROUTER!
PART SELECTOR TABLE
PART NUMBER
DESCRIPTION
MTR-H5-B07
HSPA+ Router w/o Accessories
MTR-H5-B07-US
HSPA+ Router w/US Accessory Kit
MTR-H5-B08
HSPA+ Router w/GPS w/o Accessories
MTR-H5-B08-US
HSPA+ Router w/GPS & US Accessory Kit
MTR-H5-B09
HSPA+ Router w/Wi-Fi w/o Accessories
MTR-H5-B09-US
HSPA+ Router w/Wi-Fi & US Accessory Kit
MTR-H5-B10
HSPA+ Router w/Wi-Fi /GPS w/o Accessories
Figure 1: MultiConnect
rCell 100 Series Routers
MTR-H5-B10-US
HSPA+ Router w/Wi-Fi/GPS & US Accessory Kit
MTR-H5-B07-HZ
HSPA+ Router w/Class I Div 2 Kit (US & Canada only)
The MultiConnect® rCell 100 Series
of cellular routers are a part of
MultiTech’s comprehensive portfolio
of cellular connectivity products
optimized for M2M (machineto-machine) communications.
With a powerful remote Device
Management platform, active on
all MultiConnect rCell 100 Series
routers, truck rolls are a thing of
the past! Optimizing efficiency and
providing the most compelling return
on investment to our customers.
MTR-H5-B10-HZ
HSPA+ Router w/Wi-Fi/GPS & Class I Div 2 Kit (US & Canada
only)
MTR-EV3-B07-N3
EV-DO Router w/o Accessories (Verizon)
MTR-EV3-B07-N3-US
EV-DO Router w/US Accessory Kit (Verizon)
MTR-EV3-B08-N3
EV-DO Router w/GPS w/o Accessories (Verizon)
MTR-EV3-B08-N3-US
EV-DO Router w/GPS & US Accessory Kit (Verizon)
MTR-EV3-B09-N3
EV-DO Router w/Wi-Fi w/o Accessories (Verizon)
MTR-EV3-B09-N3-US
EV-DO Router w/Wi-Fi & US Accessory Kit (Verizon)
MTR-EV3-B10-N3
EV-DO Router w/Wi-Fi/GPS w/o Accessories (Verizon)
MTR-EV3-B10-N3-US
EV-DO Router w/Wi-Fi/GPS & US Accessory Kit (Verizon)
MTR-EV3-B07-N16
EV-DO Router w/o Accessories (Aeris)
MTR-EV3-B07-N16-US
EV-DO Router w/US Accessory Kit (Aeris)
The MultiConnect rCell 100 Series of
cellular routers also offers a shared
design approach across all major
cellular technologies, and a long
and stable lifecycle, all important
considerations for M2M applications.
MTR-EV3-B08-N16
EV-DO Router w/GPS w/o Accessories (Aeris)
MTR-EV3-B08-N16-US
EV-DO Router w/GPS & US Accessory Kit (Aeris)
MTR-EV3-B09-N16
EV-DO Router w/Wi-Fi w/o Accessories (Aeris)
MTR-EV3-B09-N16-US
EV-DO Router w/Wi-Fi & US Accessory Kit (Aeris)
MTR-EV3-B10-N16
EV-DO Router w/Wi-Fi/GPS w/o Accessories (Aeris)
MTR-EV3-B10-N16-US
EV-DO Router w/Wi-Fi/GPS & US Accessory Kit (Aeris)
MTR-EV3-B10-N16-US-AR
EV-DO Router w/Wi-Fi/GPS & US Assessory Kit (Aeris/Active)
MTSIM-AR
Pre-activated Aeris Mini SIM Card
MTR-C2-B16-N3
1xRTT Router w/o Accessories (Verizon)
MTR-C2-B16-N3-US
1xRTT Router w/US Accessory Kit (Verizon)
MTR-C2-B17-N3
1xRTT Router w/GPS w/o Accessories (Verizon)
MTR-C2-B17-N3-US
1xRTT Router w/GPS & US Accessory Kit (Verizon)
MTR-C2-B16-N16
1xRTT Router w/o Accessories (Aeris)
MTR-C2-B16-N16-US
1xRTT Router w/US Accessory Kit (Aeris)
MTR-C2-B17-N16
1xRTT Router w/GPS w/o Accessories (Aeris)
MTR-C2-B17-N16-US
1xRTT Router w/GPS & US Accessory Kit (Aeris)
BENEFITS
• Fully certified and carrier approved
for use in the U.S., Canada, European
Union and Australia
• 5-7 year product lifecycle
• Wide selection of cellular
technologies and models to optimize
deployment needs
• Remote Device Management to
simplify and scale deployments at no
additional cost
• Quick deployments to shorten time
to market
• Lowest total cost of ownership
For information on European and Australian models, contact your Future
representative.
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
| 802.15.4
|| BLUETOOTH
|ANTENNAS
CELLULAR
/ SUB-GIG
10
PART SELECTOR TABLE
MODEL
MTR-H5-XX
MTR-EV3-XX
MTR-C2-XX
Technical Specifications
Performance
HSPA+
EV-DO
cdma2000 1xRTT
Frequency Band
Hepta-band 800/850/900/
AWS 1700/2100 MHz
Quad-band
850/900/1800/1900 MHz
Dual-band 800/1900 MHz
Dual –band 800/1900 MHz
Packet Data
Up to 21.0 Mbps DL
Up to 5.76 Mbps UL
Up to 3.1 Mbps DL
Up to 1.8 Mbps UL
Up to 153.6K DL
Up to 153.6K UL
SMS
Point-to-Point Messaging,
Mobile-Terminated SMS,
Mobile-Originated SMS
Point-to-Point Messaging,
Mobile-Terminated SMS,
Mobile-Originated SMS
Point-to-Point Messaging, MobileTerminated SMS, Mobile-Originated SMS
Operating Voltage
7V to 32V DC
Connectors
SIM Interface
Standard 1.8 and 3V Mini
SIM receptacle
N/A
N/A
Physical Description
Physical Dimensions
4.17” x 3.0” x 1.15” (10.6cm x 7.6cm x 2.9cm)
Environmental
Operating Temperature
-40° to +185°F (-40°C to +85°C)
Storage Temperature
-40° to +185°F (-40°C to +85°C)
Humidity
Relative humidty 15% to 93% noncondensing
Certifications
Regulatory
FCC Class B (US), IC (Canada), R&TTE (EU Economic
Area), A-Tick (Australia/NZ)
FCC Class B (US)
FCC Class B (US)
Safety
UL60950-1 (US), UL 201 (US),
Class I Div 2 (US & Canada),
cUL60950-1 (Canada),
IEC60950-1 (EU Economic
Area), AS/NZS 60950.1 (Australia/NZ)
UL60950-1 (US), UL 201 (US),
Class I Div 2 (US and Canada)
UL 60950-1 (US), UL 201 (US)
Network
PTCRB, GCF approved module, AT&T, T-Mobile, Telstra,
EU carriers
Pending: Rogers, Bell, Telus
Aeris, Verizon
Pending: Sprint
Verizon, Aeris
Quality
MIL-STD-810: High Temp, Low Temp, Cold Dwell, Random Vibration & Sine Vibration
SAE J1455: Randon Vibration & Sine Vibration
FEATURES
• HSPA+, EV-DO and CDMA2000
1xRTT
• Secure and manage remotely with
Device Manager
• 10/100BaseT Ethernet LAN
connectivity
• RS-232 serial port with Modbus
support
APPLICATIONS
• External SMA antenna connector for
improved range & performance
• Models available with Wi-Fi®,
Bluetooth® and GPS connectivity
• Class I Div 2 models for U.S. and
Canada
• Two-year warranty, upgradeable to
five years
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
| 802.15.4
|| BLUETOOTH
|ANTENNAS
CELLULAR
/ SUB-GIG
•
•
•
•
•
•
Digital Signage
Smart Vending
Kiosks/POS
Remote Monitoring
Smart Energy
Home Medical Monitoring
11
SIERRA WIRELESS AIRPRIME® EMBEDDED
MODULES HL SERIES
Compact, Flexible, and Future Proof 2G, 3G, and 4G
Essential Modules
Sierra Wireless AirPrime®
HL embedded modules offer
everything device manufacturers
need to meet essential
connectivity requirements for
machine-to-machine (M2M)
applications such as healthcare,
point of sale terminals, fleet
management, tracking, and
consumer electronics.
Figure1: HL Series
Key differentiators include a
common form factor, small
size, low-power consumption,
enhanced RF performance,
optional GNSS (GPS and
GLONASS), and worldwide
coverage.
COMPACT: THE SMALLEST 2G
TO 4G FORM FACTOR ON THE
MARKET
Figure 2: Snap-in option or
solder-down design
The HL Series is the smallest module
on the market sharing a common
form factor across 2G, 3G, and 4G
technologies. Now, with just one
PCB design, device manufacturers
can easily integrate voice and
data connectivity and deploy in
any region, on any wireless mobile
network.
The compact form factor offers
the choice of soldering down the
module for efficient high-volume
production or, using a snap-in socket
on the same solder pads for total
flexibility in prototyping or smaller
volume runs. The innovative snap-in
socket allows device manufacturers
to deploy or change modules at any
point in the production and product
life cycles.
FUTURE PROOF: INTELLIGENT
PIN-TO-PIN COMPATIBILITY
TO SUPPORT EVOLVING
TECHNOLOGIES
The core and extension pins on
the common form factor enables
forward and backward compatibility
between the different 2G, 3G, and
4G module variants. This means that
the mechanical pin location delivers
the same function across the series.
The optional custom pins allow for
new features as technology evolves
making it the most future proof
module on the market.
KEY FEATURES
KEY BENEFITS
• Smallest 2G to 4G form factor on the
market
• Device management made easy
with ready-to-use firmware upgrades
using AirVantage Management
Service
FLEXIBLE: SOLDER DOWN OR
CHOOSE THE SNAP!IN SOCKET
TO SWITCH MODULES ANY TIME
• Use one design for your 2G, 3G, and
4G deployments
• Choose between LGA solder-down
or snap-in integration, for supplychain and lifecycle management
requirements
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
| 802.15.4
|| BLUETOOTH
|ANTENNAS
CELLULAR
/ SUB-GIG
• GSM/GPRS/EDGE/HSUPA/HSDPA/
LTE
• GNSS (GPS + GLONASS)
• Dual SIM Dual Standby technology
for maximum network connectivity
12
DEVELOPMENT KIT
Figure 3: AirPrime HL6528
Development Kit
• Network Technology: GPRS, GSM
• Frequency Bands: 850/900/1800/1900
MHz
• Carrier Certifications: Orange,
Telefonica, Vodafone
• Regulatory Certifications: R&TTE,
CE, GCF-CC, FCC, PTCRB, RoHS
Compliant
• Antenna Diversity Support: No
• Operating temperature: -40°C to
+85°C
• Form factor: Solder-down / SMT
Mounting
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
| 802.15.4
|| BLUETOOTH
|ANTENNAS
CELLULAR
/ SUB-GIG
This development kit includes:
• 1 AirPrime HL6528 module on socket
boards
• 1x HL Series development kit mother
board
• 1x power supply AC100/240V, DC
4V/2.5A
• 1x multiple AC outlet adaptor
• 1x integrated quad-band GSM
antenna/ penta-band WCDMA/ GPS
& Glonass (SMA)
• 1x handset with cable
13
GAINSPAN : HD / FULL HD VIDEO APPLICATION
DEVELOPMENT KITS
Everything you need to quickly and easily develop and deploy a
wide variety of applications using GainSpan technology.
Figure 1: Video ADK
GainSpan’s Video Application
Development Kits (ADKs) accelerate
time to market for customers
seeking to add high-quality HD /
Full HD video streaming capabilities
to their IOT (Internet of Things)
products. The video ADKs include
reference hardware designs
integrating GainSpan’s Wi-Fi
modules with leading video encoder
SOC vendors; embedded software
integrating streaming protocols
including RTSP, UDP; and mobile
applications for smartphone/tablets.
These ADKs are built on the new
ultra-low power GS2000 Wi-Fi SOC
and leverage the key advantages
of the GS2000-high data rates
supported in the 802.11b/g/n SoC,
multi-mode connectivity, extremely
low standby current and fast wake
up, and low power operation. Multimode connectivity enables concurrent
connection to smartphone, cloud and
a variety of other IOT devices in the
home such as door locks, smartplugs,
smart thermostats etc. The video
ADKs enable a whole slew of video
applications aimed at markets such
as battery powered IP cameras, PIR
camera, doorbell cameras, intercom
systems, wearables, remote controlled
toys, and automotive aftermarket.
FEATURES
BENEFITS
• Complete reference design for
streaming video applications
• Supports HD (720p60/1080p30) H.264
RTSP and UDP streaming
• High data throughput over SDIO / SPI
• Fast wake up
• Low power consumption
• mDNS / Bonjour discovery
• Multi-mode connectivity – concurrent
support for limited AP/client; web
server / client
• Hardware encryption
• Multiple provisioning methods
• Over-the-air Firmware upgrade
• Fast time to market
• Excellent video quality with support
of high resolution video
• Low latency
• Supports battery powered applications
• Easy connectivity to mobile devices
• Simultaneous connectivity to
smartphone and cloud
• Management of IOT devices in the
home through a camera product
• Secure video
• Easy provisioning of the cameras / IOT
devices using iOS/Android devices
• Easy software upgrade of customer
product in the field
APPLICATIONS
•
•
•
•
Security / IP Cameras
Wi-Fi Doorbells
Baby Monitors
PIR cameras
• Intercom systems
• Wearable video
• Automotive backup camera
PART SELECTOR TABLE
PART NUMBER
DESCRIPTION
GS-ADKVideoGeo1080p
Full HD 1080p30 resolution, GEO Semi Max64380 H.264 encoder, GS2011M
low-power Wi-Fi module, mono audio codec, mono 2.6W amplifier, mobile
applications (iOS and Android), supports multiple streaming protocols
including RTP/RTSP and UDP. Planned support for cloud connectivity.
GS-ADKVideoGeo720p
HD 720p30 resolution, GEO Semi Max64380 H.264 encoder, GS2011M
low-power Wi-Fi module, mono audio codec, mono 2.6W amplifier, mobile
applications (iOS and Android), supports multiple streaming protocols
including RTP/RTSP and UDP. Planned support for cloud connectivity.
GS-ADKVideoOV720p
HD 720p30 resolution, OV 9712 image sensor, OV788 encoder, GS2011MIZ
low-power Wi-Fi module, mobile applications (iOS and Android), supports
multiple streaming protocols.
GS-AEKVideoGeo1080p
Full HD 1080p30 resolution, GEO Semi Max64380 H.264 encoder, GS2011M
low-power Wi-Fi module, mono audio codec, mono 2.6W amplifier, supports
multiple streaming protocols including RTP/RTSP and UDP. Planned support
for cloud connectivity. Includes binary version of the software.
GS-AEKVideoGeo720p
HD 720p30 resolution, GEO Semi Max64380 H.264 encoder, GS2011M
low-power Wi-Fi module, mono audio codec, mono 2.6W amplifier, mobile
applications (iOS and Android), supports multiple streaming protocols
including RTP/RTSP and UDP. Planned support for cloud connectivity.
Includes binary version of the software
GS-AEKVideoOV720p
HD 720p30 resolution, OV 9712 image sensor, OV788 encoder, GS2011MIZ
low-power Wi-Fi module, mobile applications (iOS and Android), supports
multiple streaming protocols. Includes binary version of the software.
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
| GPS
| 802.15.4
|| BLUETOOTH
|/ANTENNAS
CELLULAR
GNSS
| WI-FI
/ SUB-GIG
MODULE
14
WI-FI® 802.11 B/G/N
NETWORK CONTROLLER MODULE
Model: SN820X
SN820X MODULE FEATURES
• 2.4GHz IEEE 802.11b/g/n
• Chipset: Broadcom BCM43362 WiFi® and ST Micro
• STM32 ARM Cortex-M3
• Supports WPA/WPA2 PSK, WPS
• Supports Wi-Fi AP/STA Dual mode
• Supports built-in TCP/IP Stack, SSL/
TLS, HTTP, DHCP,
• DNS, and Web Server with:
• Murata EZ Web Wizzard™ software or
• Broadcom WICED™ SDK
MODULE SPECIFICATIONS
Figure 1: SN820X
The SN820X is a family of small,
low-power, self-contained, certified
Wi-Fi® network controller modules
that provide simple serial-to-WiFi® connectivity to the internet.
These modules are an ideal
solution for device manufacturers
who are looking to add wireless
connectivity to home appliances,
smart energy systems, healthcare
and industrial control equipment.
Technology
2.4GHz IEEE 802.11b/g/n
Antenna Configuration
On-board or U.FL Connector
Transmit power
+18 dBm @b mode/11Mpbs
Max receive sensitivity
-96dbm
Host Interface
UART, SPI
Sensor applications support
GPIO, I2C, ADC, DAC
Operating Temperature
-40°C to +85°C
The SN820X modules are enabled
with Broadcom Corporation’s
Wireless Internet Connectivity
for Embedded Devices (WICED)
architecture. They can host the WiFi®, TCP/IP network stack, security
supplicant, and other network
application features. Those
features are supported by the
Murata Simple Network Interface
Controller (SNIC) software and
EZ Web Wizzard™ platform. The
modules are also compatible with
Broadcom WICED SDK.
Figure 2: Module Block Diagram
SN820X SERIES SELECTOR TABLE
MODEL NUMBER
ORDERING PART NUMBER
RAM SIZE
FLASH SIZE
SN8200
88-00151-00
96KB
768KB
SN8200UFL
88-00151-02
96KB
768KB
SN8205
88-00158-00
128KB
1024KB
SN8205UFL
88-00158-02
128KB
1024KB
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
| GPS
| 802.15.4
|| BLUETOOTH
|/ANTENNAS
CELLULAR
GNSS
| WI-FI
/ SUB-GIG
MODULE
15
Figure 3: Package Dimentions (mm)
EVALUATION BOARD
FEATURES
• SN820X Wi-Fi Network Controller
• Mini-USB connector supporting USBJTAG and USBserial interfaces
• Pads for headers to access the I/O
pins of the SN820X module.
• Serial fl ash (8M bits) and interface
header
• SHT21 temperature and relative
humidity sensor
• UART interface header
SN820X FAMILY TABLE
PART NUMBER
MODEL NUMBER
SN8200 EVK+
88-00151-95
SN8200UFL EVK+
88-00151-97
SN8205 EVK+
88-00158-95
SN8205UFL EVK+
88-00158-97
Figure 4: Evaluation Board
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
| GPS
| 802.15.4
|| BLUETOOTH
|/ANTENNAS
CELLULAR
GNSS
| WI-FI
/ SUB-GIG
MODULE
16
SILEX: 802.11B/G/N AND 802.11A/B/G/N
EMBEDDED INTELLIGENT WIRELESS MODULES
Serial/USB/Ethernet to Wi-Fi Modules
FEATURES
Figure 1: SX-580
The SX-570/SX-580 highperformance Serial/USB/Ethernet to
Wi-Fi modules provide connectivity
for low-power portable devices to
802.11 wireless networks (WLAN’s).
Eliminating the need for the
development of a wireless LAN
driver and security supplicant, it is
ideal for minimizing engineering
investment and reducing time to
market.
Measuring 1.18 x 2.16 inches (30
x 55 mm), the SX-570/SX-580
features a powerful 32-bit 454
MHz Freescale i.MX28 processor
with an 802.11a/b/g/n radio, a
complete TCP/IP network protocol
stack, and an optimized AR6003
wireless radio driver and security
supplicant in a self-contained
hardware package. One major
advantage of the SX-570/SX-580 is
enterprise security, including WPA2
with 802.1x authentication, which
enables it to be used on almost any
customer’s network without security
compromises. Another feature
enhancement is the implementation
of the WPS feature which allows
clients to easily connect to any
network with WPA2 security.
The SX-570/SX-580 is designed
to connect to a wide range of
OEM devices without the need for
special software drivers or interface
hardware.
• Supports IEEE802.11a/b/g/n
• Industry-leading enterprise security
including WPA, WPA2, WEP plus
802.1x authentication
• Supports Wi-Fi Protected Setup
• AP Mode: Enables the SX-570/SX-580
to operate as an access point with
support up to 10 connectable slots.
• Supports Bluetooth as an option.
• Freescale i.MX28 processor with an
802.11a/b/g/n radio, a complete TCP/
IP network protocol stack
• Serial or Ethernet to Wi-Fi
• Accepts setting changes from a serial
•
•
•
•
port in Console Mode. Telnet and HTTP
setting configuration is also available
Can be used as a TCP/IP supported
print server
Complies with RoHS Directives
Has an 8MB flash memory and a 64MB
SDRAM. An option to upgrade the
flash memory to 16MB
SX-580-6900, evaluation board, is
available for your development. This
board includes an RJ45 Ethernet
connector, three serial connectors, one
USB connector, header connectors
for all major I/O, AC adaptor, and a
wireless LAN antenna
Figure 2: Block Diagram
PART SELECTOR TABLE
PART NUMBER
DESCRIPTION
SX-580-2700
SX-580 802.11 a/b/g/n Intelligent Module Evaluation Kit
SX-570-2700
SX-570 802.11 b/g/n Intelligent Module Evaluation Kit
SX-580-2700-SP
SX-580 802.11 a/b/g/n Intelligent Module Evaluation Kit (Single
Pack)
SX-570-2700-SP
SX-570 802.11 b/g/n Intelligent Module Evaluation Kit (Single
Pack)
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
| GPS
| 802.15.4
|| BLUETOOTH
|/ANTENNAS
CELLULAR
GNSS
| WI-FI
/ SUB-GIG
MODULE
17
BENEFITS
• Based on Qualcomm Atheros
AR6003. This game changing chip
technology enables the SX-570/
SX-580 to provide breakthrough
performance at the lowest cost.
• Linux operating system with user
programmability. The SX-570/SX-580
is uses the Linux operating system
and is designed to allow users to
easily add new features. With a
454MHz processor and 16MB of RAM
and 8MB of flash memory, the SX570/SX-580 has plenty of capacity to
handle complex user applications.
• Reduced power consumption. The
SX-570/SX-580 uses a minimum
amount of power during transmitting
and receiving, and its power
management reduces power usage
during periods of inactivity.
APPLICATIONS
• The SX-570/SX-580 highperformance intelligent modules are
designed for connecting portable
devices to 802.11 wireless local area
networks (WLANs), and eliminate
the need for the development
investment of the wireless LAN driver
and security supplicant.
• They are ideal for OEM applications
that need WLAN connectivity with
minimal power usage, such as
battery-operated portable devices
for medical, printer, weights and
measures, and other applications.
Figure 3: Mechanical Specifications
SPECIFICATIONS
ITEM
CPU
MCIMX280CVM4B (Freescale)
Clock Frequency 454MHz
Radio
SX-SDMGN (SX-570)
SX-SDMAN (SX-580)
FLASH ROM
(SPI Interface)
[Standard]
8MB S25FL064P0XNFI000 (Spansion)
[UP]
16MB S25FL128P0XNFI000
(Spansion)
SDRAM
64MB DDR2 (32M x 16bit
Clock Frequency 205MHz (maximum)
Ethernet PHY
10BASE-T 100BASE-TX
LAN8720Ai-CP (SMSC)
Interface
To download these resources please visit
http://fcs.futureelectronics.com/
UNIT
NOTE
(SX-570) IEEE802.11 b/g/n/e/i
(SX-580) IEEE802.11 a/b/g/n/e/h/i
Bluetooth 3.0 (unsupported to
3.0+HS)
DOWNLOADABLE EXTRAS
• Product Brief
• Developers Reference and User
Manual
• Console Command Line Interface
Documentation
SPECIFICATION
USB 2.0 OTG×1
USB 2.0 Host×1
Ethernet 10/100×1
1 port: CTS/RTS flow
2 port: No flow control
UART ×3
SPI×1
I2C×1
Connector Type
50-pins connector
Antenna Connector
(SX-570 SX-580)
U.FL Alternative Connector x 2
Weight
SX-570 9
SX-580 10
g
Dimension
55×30
mm
MTBF
90,000
h
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
TECHNOLOGY
| GPS
| 802.15.4
|| BLUETOOTH
|/ANTENNAS
CELLULAR
GNSS
| WI-FI
/ SUB-GIG
MODULE
HIROSE : DF12-50DS-0.5V(86)
W x H , PCB Thickness =
1.0mm.
18

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